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The future of miniaturization in wearable products
Wearables is among the fastest growing domains in consumer goods, and one that depends extensively on miniaturization in electronics. Consumers are getting increasingly dependent on smartphones and smart watches with extensive features – those that track their daily walking steps, display health parameters, book appointments, deliver emails and more. Then there are those earbuds that deliver high fidelity stereo sound minus the cables. Soon the market would see smart glasses with built in capability to take photographs, record videos, and offer augmented reality. Common to all these products is the fact that they are marvels enabled by miniaturization and the amazing developments made possible in design and manufacture. This is beyond the size reductions possible by shrinking semiconductor devices and newer approaches are needed to get to where we wish to. Among the most successful of the approaches being ushered in is ‘SiP’, System in a Package technology. Simply explained, SiP technology is a completely sealed package consisting of all active and passive components of an electronic subsystem along with the required interconnections. SiP presents very important benefits. For one, since the interconnections are short, high operating speeds can be achieved. Also, within the package, components can be stacked for optimum space utilization. The other design advantage is the effective EMC shielding and since the package is completely sealed, it is protected from the external environment, very crucial for wearable technology. An excellent example of the SiP approach being deployed successfully in wearable technology is True Wireless Stereo (TWS), incorporated in the present generation smart earbuds. These earbuds do not need physical connections and can connect via Bluetooth. Also, their internal batteries are charged inductively. True wireless technology earbuds also offer features such as volume control and track selection, but the real differentiator is the accommodation of batteries in this tiny device. This has been achieved by shrinking the electronic components used in the earbuds through SiP technology. Miniaturization of electronic subassemblies frees up space enabling designers to accommodate larger and more effective batteries without enhancing the size of a device. This makes it possible to create devices with longer battery life, a key requirement of end users across segments. Manufacturing of such miniaturized subsystems requires a huge level of expertise and cutting-edge technology, a capability that rests with a few companies. Syrma SGS Technology offers the best electronic manufacturing services in India and has world class expertise in developing optimal electronics design, engineering and production. The company is one of the best electronic systems design and manufacturers in India and offers a high mix, flexible volume precision manufacturing and designs custom magnetic, memory and RFID solutions.